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Solder Joint Reliability Of Bga, Csp, Flip Chip, And Fine Pitch Smt Assemblies

(机翻)BGA、CSP、倒装芯片和小间距SMT组件的焊点可靠性

[John Lau, Yi-hsin Pao]

O59

9780070366480 USD65.0

Mcgraw-hill Professional 1996-09-01 Hardback

Circuits & components
Flip Chip Technologies

(机翻)倒装芯片技术

[John Lau]

O59

9780070366091 USD89.0

Mcgraw-hill Professional 1995-12-01 Hardback

Circuits & components

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