Solder Joint Reliability Of Bga, Csp, Flip Chip, And Fine Pitch Smt Assemblies

(机翻)BGA、CSP、倒装芯片和小间距SMT组件的焊点可靠性

[John Lau, Yi-hsin Pao]

O59

9780070366480  USD65.0

Mcgraw-hill Professional   1996-09-01   Hardback

Circuits & components